End-to-End BGA Assembly – PCB to Finished Board
Overview
End-to-end BGA assembly—from bare PCB to finished, tested, and shipped board—simplified through one integrated service. Studio Electronics offers End-to-End BGA Assembly supporting your project from PCB fabrication through component procurement, SMT assembly, BGA process optimization, X-Ray inspection, and final shipping. As a premier provider of PCB assembly in China, we combine 12 automated SMT lines, specialized BGA expertise, and advanced 3D X-Ray inspection to deliver reliable BGA assemblies with complete documentation.
End-to-End BGA Service – PCB to Finished Board
| Service Stage |
Studio Capability |
Quality Check |
| PCB Fabrication |
In-house or customer-provided |
Material certification; controlled processes |
| Component Sourcing |
Authorized distributors; full BOM procurement |
Incoming inspection; LCR testing; traceability |
| SMT Assembly |
12 SMT lines; ±25μm accuracy |
SPI; AOI; real-time monitoring |
| BGA Placement |
All BGA types; vision alignment |
±25μm accuracy; optimized placement |
| Controlled Reflow |
Custom profiles per BGA; nitrogen option |
Profile validation; thermal monitoring |
| X-Ray Inspection |
2D and 3D X-Ray—100% coverage |
Void analysis; automated calculation |
| Testing |
ICT; Flying Probe; FCT—100% coverage |
Documented results per board serial number |
| Shipping |
Anti-static packaging; global logistics |
Packaging verification; tracking; delivery |
Our End-to-End BGA Assembly Process
Stage 1: PCB Fabrication – In-house PCB fabrication (2-20+ layers; rigid/flex; multiple finishes).
Stage 2: Component Sourcing – Components procured through authorized distributors. For low volume PCB assembly, small-quantity procurement supported.
Stage 3: Engineering Review – BGA design review; reflow profile optimization; stencil design.
Stage 4: SMT & BGA Assembly – 12 SMT lines with ±25μm accuracy. BGA placement with vision alignment. Controlled reflow. Nitrogen reflow available.
Stage 5: X-Ray Inspection – 100% coverage; 2D and 3D X-Ray; void analysis; automated void calculation.
Stage 6: Testing & Final Assembly – ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.
Why End-to-End BGA Assembly Matters
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Complete Accountability – One supplier for your entire project
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Specialized Expertise – BGA process optimization and X-Ray verification
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Quality Assurance – 100% X-Ray inspection; full traceability
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Time Efficiency – No handoff delays between vendors
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Cost Effectiveness – Eliminate multiple vendor markups
Studio delivers End-to-End BGA Assembly—PCB to finished board with 100% X-Ray verification on every BGA.
