Quality BGA Assembly – 100% X-Ray Inspection
Overview
Quality in BGA assembly is defined by what you cannot see—the solder joints hidden beneath the component body. Studio Electronics offers Quality BGA Assembly with 100% X-Ray inspection on every board. As a premier provider of PCB assembly in China, we combine specialized BGA process expertise with advanced 2D and 3D X-Ray systems to verify every solder joint. Our complete turnkey service covers component procurement through final shipping, with uncompromising quality verification at every stage.
100% X-Ray Inspection – Our Quality Commitment
| Inspection Parameter |
What We Detect |
Acceptance Criteria |
| Ball Alignment |
Misaligned or offset balls |
All balls aligned to pads within specification |
| Bridging |
Solder bridges between adjacent balls |
No electrical shorts; minimum spacing maintained |
| Missing Balls |
Absent or misplaced balls |
All balls present; correct ball count verified |
| Voids |
Internal voids within solder balls |
Void ratio <15% per ball (IPC Class 2/3) |
| Cold Solder |
Poor wetting or incomplete soldering |
All joints show proper wetting; no cold joints |
| Head-in-Pillow |
Incomplete ball-to-pad connection |
Detected through 3D X-Ray analysis |
Our Quality BGA Assembly Process
Stage 1: Component Sourcing & Incoming Inspection
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Incoming inspection verifies component integrity and BGA ball condition.
Stage 2: Solder Paste Application
3D SPI verifies paste volume, height, and area. Real-time feedback ensures consistent deposition.
Stage 3: Precision BGA Placement
12 SMT lines with advanced BGA placement. Vision systems ensure accurate alignment. ±25μm placement accuracy.
Stage 4: Controlled Reflow
Custom reflow profiles optimized per BGA type. Closed-loop temperature control; nitrogen reflow option.
Stage 5: 100% X-Ray Inspection
- 2D X-Ray – Ball alignment, bridging, missing balls—fast detection
- 3D X-Ray – Void analysis; automated void calculation per ball
- Documentation – X-Ray images stored per board serial number
- Coverage – 100% of BGA boards; not sampled
Stage 6: Electrical Testing & Final Verification
ICT; Flying Probe; FCT. AOI for visible components. Reliability lab testing available.
Stage 7: Final Assembly & Shipping
Careful handling; anti-static packaging; global logistics with tracking.
Why 100% X-Ray Inspection Matters
| BGA Quality Risk |
Visual Inspection |
Studio's X-Ray Solution |
| Hidden voids |
Cannot detect |
3D X-Ray; automated void analysis |
| Head-in-pillow defects |
Cannot detect |
3D X-Ray; precise joint analysis |
| Ball bridging |
Cannot detect |
2D X-Ray; ball spacing verification |
| Cold solder joints |
Cannot detect |
X-Ray; solder wetting evaluation |
| Missing balls |
Cannot detect |
X-Ray; ball count verification |
Studio delivers Quality BGA Assembly—100% X-Ray inspection on every board, every BGA, every ball.
